PRODUCTS

CONTACT EXPOSURE PHOTO IMAGEABLE SOLDER RESIST.
FINEDEL DSR series is a liquid solder resist of alkali development type.Is suitable to general printed circuit boards and coating film has an outstanding heat resistance.Is suitable for gold plating with excellent chemical resistance. Is an One-liquid type solder resist. Is an alkali development type liquid solder resist and used for airless splay, electrostatic spray.Is an alkali development type liquid solder resist and used for curtaincoater. These solder resists have sharp patterning resolution and excellent solder resist film property for the production of printed circuit boards that require fine pattern with high density packing.


 

ULTRAVIOLET-CURED INK
PHOTOCOAT USR series are ultraviolet cured solder resist.Is suitable to general printed circuit boards and coating film has an outstanding heat resistance.Is suitable for hot air leveller of printed circuit board with copper through holes. Is quite efficient for gold plating with excellent chemical resistance. Is suitable to general printed circuit board with excellent coated film hardness & printed resolution.Ultraviolet cured solder resists development for flexible printed circuit boards.

ULTRAVIOLET-CURED INK
PHOTOCOAT USI series is an ultraviolet cured marking ink which has an excellent adhesion and heat resistance for various types of printed circuit boards


CARBON CONDUCTIVE PAINT
CARBOLLOID series are conductive carbon printed paints of low resistivity with specially refined carbon.


TECHNICAL DATA (COMPARISON OF CHARACTERISTICS) OSP FOR 〝GOLD-PLATED MIXED LOAD〞BOARDS SOLDERITE WPF-21
1)    Discoloration of gold-plated section will be prevented
2)    Organic film coat excellent in heat and humidity resistance is formed on the surface of copper
3)    Heat resistance is improved as compared with the conventional water-soluble pre-flux. Excellent solder ability is shown even after reflow processing of plural number of times
4)    Excellent in the spread of wetting ability of solder paste
5)    Excellent in flow solder ability of lead-free solder
6)    Thin and uniform film is formed to produce excellent smoothness in copper foil land,so that the material is suited for high density packaging board
7)    Not flarmmable as no organic solvent is contained